Semiconductor packaging materials interaction and reliability /

Bibliographic Details
Other Authors: Chen, Andrea., Lo, Randy.
Format: Electronic
Language:English
Published: Boca Raton : CRC Press, 2011.
Subjects:
Online Access:https://recursos.uloyola.es/login?url=https://accedys.uloyola.es:8443/accedix0/sitios/ebook.php?id=155191
Description
Physical Description:xviii, 187 p. : ill.
Bibliography:Includes bibliographical references.